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Metamaterial design approaches, which integrate structural elements into material systems, enable the control of uncommon behaviours by decoupling local and global properties. Leveraging this conceptual framework, metamaterial adhesives incorporate nonlinear cut architectures into adhesive films to achieve unique combinations of adhesion capacity, release, and spatial tunability by controlling how cracks propagate forward and in reverse directions during separation. Here, metamaterial adhesive designs are explored with triangular cut features while integrating hierarchical and secondary cut patterns among primary nonlinear cuts. Both cut geometry and secondary cut features tune adhesive force capacity and energy of separation. Importantly, the size and spacing of cut features must be designed around a critical length scale. When secondary cut features are greater than a critical length, cracks can be steered in multiple directions, going both forward and backwards within a primary attachment element. This control over crack dynamics enhances the work of separation by a factor of 1.5, while maintaining the peel force relative to a primary cut. If hierarchical cut features are too small or too compliant, they interact and do not distinctly modify crack behaviour. This work highlights the importance of adhesive length scales and stiffness for crack control and attachment characteristics in adhesive films. This article is part of the theme issue ‘Origami/Kirigami-inspired structures: from fundamentals to applications’. 

Quasi-static peeling of a finite-length, flexible, horizontal beam (strip, thin film) from a horizontal substrate is considered. The displaced end of the beam is subjected to an upward deflection or to a rotation. The action of the adhesive is modeled as a Winkler foundation, and debonding is based on the common fracture mechanics approach. The behavior is examined from the application of loading to the initiation of peeling and then to complete detachment of the beam from the substrate. During at least a portion of the debonding process, the model corresponds to what traditionally has been considered a short beam on an elastic foundation. In the analysis, the beam is modeled as an elastica, so that bending is paramount and large displacements are allowed. The effects of the relative foundation stiffness to the beam bending stiffness, the work of adhesion, and the length, self-weight, extensibility, and initial unbonded length of the beam are investigated. In addition, experiments are conducted to complement the analysis. 

Open microfluidics have emerged as a low-cost, pumpless alternative strategy to conventional microfluidics for delivery of fluid for a wide variety of applications including rapid biochemical analysis and medical diagnosis. However, creating open microfluidics by tuning the wettability of surfaces typically requires sophisticated cleanroom processes that are unamenable to scalable manufacturing. Herein, we present a simple approach to develop open microfluidic platforms by manipulating the surface wettability of spin-coated graphene ink films on flexible polyethylene terephthalate via laser-controlled patterning. Wedge-shaped hydrophilic tracks surrounded by superhydrophobic walls are created within the graphene films by scribing micron-sized grooves into the graphene with a CO 2 laser. This scribing process is used to make superhydrophobic walls (water contact angle ∼160°) that delineate hydrophilic tracks (created through an oxygen plasma pretreatment) on the graphene for fluid transport. These all-graphene open microfluidic tracks are capable of transporting liquid droplets with a velocity of 20 mm s −1 on a level surface and uphill at elevation angles of 7° as well as transporting fluid in bifurcating cross and tree branches. The all-graphene open microfluidic manufacturing technique is rapid and amenable to scalable manufacturing, and consequently offers an alternative pumpless strategy to conventional microfluidics and creates possibilities for diverse applications in fluid transport. 

Abstract Conductive adhesives are required for the integration of dissimilar material components to create soft electronic and robotic systems. Here, a heterogeneous liquid metal‐based conductive adhesive is developed that reversibly attaches to diverse surfaces with high stretchability (>100% strain), low modulus (<100 kPa), and strain‐invariant electrical conductivity. This SofT integrated composite with tacK through liquid metal (STICK‐LM) adhesive consists of a heterogeneous graded film with a liquid metal‐rich side that is embossed at prescribed locations for electrical conductivity and an electrically insulating adhesive side for integration. Adhesion behavior is tuned for adhesion energies > 70 Jm⁻²(≈ 25x enhancement over unmodified composites) and described with a viscoelastic analysis, providing design guidelines for controllable yet reversible adhesion in electrically conductive systems. The architecture of STICK‐LM adhesives provides anisotropic and heterogeneous electrical conductivity and enables direct integration into soft functional systems. This is demonstrated with deformable fuses for robotic joints, repositionable electronics that rapidly attach on curvilinear surfaces, and stretchable adhesive conductors with nearly constant electrical resistance. This study provides a methodology for electrically conductive, reversible adhesives for electrical and mechanical integration of multicomponent systems in emerging technologies. 

Abstract Rapidly controlling and switching adhesion is necessary for applications in robotic gripping and locomotion, pick and place operations, and transfer printing. However, switchable adhesives often display a binary response (on or off) with a narrow adhesion range, lack post‐fabrication adhesion tunability, or switch slowly due to diffusion‐controlled processes. Here, pneumatically controlled shape and rigidity tuning is coupled to rapidly switch adhesion (≈0.1 s) across a wide range of programmable adhesion forces with measured switching ratios as high as 1300x. The switchable adhesion system introduces an active polydimethylsiloxane membrane supported on a compliant, foam foundation with pressure‐tunable rigidity where positive and negative pneumatic pressure synergistically control contact stiffness and geometry to activate and release adhesion. Energy‐based modeling and finite element computation demonstrate that high adhesion is achieved through a pressure‐dependent, nonlinear stiffness of the foundation, while an inflated shape at positive pressures enables easy release. This approach enables adhesion‐based gripping and material assembly, which is utilized to pick‐and‐release common objects, rough and porous materials, and arrays of elements with a greater than 14 000xrange in mass. The robust assembly of diverse components (rigid, soft, flexible) is then demonstrated to create a soft and stretchable electronic device.